Application of Super-Junction MOSFETs in AGV Automated Guided Vehicles

Compared with conventional VDMOS devices, super-junction MOSFETs feature lower on‑resistance, faster switching speeds, a smaller chip footprint, and reduced thermal dissipation. Specifically, for the same current and voltage ratings, the on‑resistance of a super‑junction MOSFET is roughly half that of a traditional VDMOS, while its turn‑on and turn‑off switching times are more than 30% shorter.

I. Introduction

AGVs, also known as automated guided vehicles, automatic loading and unloading carts, or transport robots, are vehicles equipped with electromagnetic or optical automatic guidance systems. They can travel along predefined paths, feature safety safeguards, and perform various material-handling tasks. In industrial applications, these driverless transport vehicles are powered by rechargeable batteries.

In today’s rapidly evolving economy, demand continues to grow, and traditional transportation and material-handling methods can no longer keep pace with the production and operational needs of modern enterprises. Moreover, conventional material‑handling processes are labor‑intensive and yield low productivity. With their high degree of automation, AGVs have become the preferred solution for material handling across a wide range of industries.

II. Product Application Areas

AGV automated guided vehicles have a wide range of applications, including AGV carts, logistics robots, AGV robots, AGV forklifts, AGV unmanned transporters, laser‑guided AGVs, and other products.

AGVs, also known as automated guided vehicles or transport robots, are equipped with automatic guidance systems—such as electromagnetic or optical sensors—that enable them to travel along predefined paths while incorporating safety features and a variety of material-handling functions. These industrial transport vehicles operate without human operators and are powered by rechargeable batteries. With rapid economic growth, modern enterprises face ever-increasing demands for efficient transportation and material handling; traditional methods, however, require significant manpower and deliver low productivity. Thanks to their high degree of automation, AGVs have become the preferred choice for many companies. Their applications are extensive, encompassing AGV carts, logistics robots, AGV‑equipped forklifts, and more.

III. Application of Super-Junction MOSFETs in AGV Automated Guided Vehicles

AGV automated guided vehicles are equipped with a contactless power‑supply system that leverages the principle of inductive coupling. The primary winding of the split‑type transformer is divided into multiple modules; using vehicle‑position sensors, only the module of the primary winding that the AGV is currently aligned with is energized, while the secondary winding on the AGV receives the electrical energy. However, due to the air gap, the primary winding experiences a substantial magnetizing current. By sequentially energizing each primary‑winding module as the AGV’s position changes, system efficiency can be significantly improved.

For contactless power‑supply circuits, super‑junction MOSFETs offer the advantage of a multi‑layer epitaxial fabrication process. Compared with conventional trench‑type devices, they exhibit superior EMI immunity and surge‑withstand capability, delivering performance comparable to that of leading international brands. Moreover, super‑junction MOSFETs outperform traditional VDMOS devices in terms of lower on‑resistance, faster switching speeds, smaller die size, and reduced thermal dissipation. Specifically, for the same current and voltage ratings, the on‑resistance of a super‑junction MOSFET is roughly half that of a conventional VDMOS, while its turn‑on and turn‑off switching times are more than 30% shorter. These characteristics enable super‑junction MOSFETs to deliver improved thermal performance and higher efficiency when replacing traditional VDMOS devices; typically, adopting super‑junction MOSFETs can boost power‑supply efficiency by 1–2 percentage points. In addition, super‑junction MOSFETs can be fully integrated with driver ICs into a single package, significantly reducing overall product footprint.