Advantages of TOLL‑packaged Schottky diodes for PD fast charging

TOLL‑packaged Schottky diodes demonstrate significant advantages in the PD fast‑charging market, primarily owing to their compact design, efficient thermal management, and superior electrical performance.

TOLL Encapsulation Schottky diode In PD The fast-charging sector demonstrates significant advantages, primarily owing to its compact design, efficient thermal management, and superior electrical performance. The following is a detailed analysis:

 

I. Advantages in Volume and Integration Density

Ultra-thin, compact design
TOLL Encapsulation thickness is only 2.3mm , compared to the traditional TO-263 Package height reduced 50% , reducing the board footprint 30% , compatible PD Fast charging to “ Ultra-thinning ” stringent requirements (such as thickness) <2mm (Gallium nitride fast-charging adapter).

Example: TOLL-8L The size is 9.9mm×11.68mm , can be directly replaced TO-220、TO-247 Waiting for plugin packaging to simplify. PCB cloth

Lightweight and High Density
Pinless ( Leadless ) Designed to reduce wiring complexity, support double-sided surface-mount technology, enhance integration, and help achieve “ Lipstick-style ” Mini fast charging.

 

II. Advantages in Heat Dissipation and Thermal Management

PCB Direct cooling
TOLL Encapsulation passed. PCB Via ( VIAs ) Vertical heat conduction, thermal resistance ( RθJC ) as low as 0.5℃/W 6 , in 3-5A In current‑carrying applications, no external heat sink is required; it relies solely on… PCB Copper foil can effectively dissipate heat.

Test data: 40A The temperature rise under continuous current is only 61℃ (Ordinary PCB ) or 32℃ (Aluminum substrate).

High-Temperature Environmental Adaptability
Adopting the sintered silver process and ClipBond Bonding technology, supports 175℃ Junction temperature, suitable for potting‑type power supplies and other fanless high‑temperature applications.

 

III. Electrical Performance Optimization

Low conduction loss
Forward voltage drop ( VF ) as low as 0.3V The following (such as B2D04065V Model at room temperature VF Only 0.55V ), compared to the traditional TO-252 Encapsulation reduction 0.1V79 , the conduction loss is better at high temperatures ( ΔVF It becomes more gradual with temperature changes.

High Frequency and Low Noise
Parasitic inductance <1nH6 , supports high-frequency switching (such as LLC Resonant topology), reduce EMI Interference, adaptation 240W PD3.1 Supports high-power fast-charging protocols.

Surge resistance capability
TOLL The package enhances the thermal path through a copper frame, with surge current capability ( IFSM ) Reach 30A ( 10ms Sine wave), meeting the inrush current requirements at the moment of grid connection.

 

 

IV. Cost and Compatibility Advantages

Simplify system design
It can replace the synchronous rectification circuit, reducing the number of secondary-side components (such as the driver). IC and MOSFET ), reduce Bill of Materials Cost.

Example: Nanxin SC3511 In the synchronous rectification scheme, TOLL Schottky diodes can simplify the secondary-side circuit.

Pin compatibility

Package pinout and traditional layout MOSFET Compatible, supports rapid replacement and upgrades, and shortens the development cycle.

 

V. Typical Application Cases

Gallium nitride fast charging : and GaN Device pairing, achieving 120W High-power-density fast charging.

Car chargers and industrial power supplies : Support 48V High-reliability applications such as mild hybrid systems and communication power supplies.

 

Summary and Recommendations

TOLL Encapsulated Schottky diode via “ Small size + Low loss + High heat dissipation ” Combination, becoming PD An ideal choice for fast charging. Design considerations:

PCB Thermal Optimization : Increase the copper foil area and via density to reduce temperature rise;

Electrostatic Protection ： TOLL Encapsulation pair ESD Sensitive; antistatic measures must be taken.